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Tecno Unveils Ultra-Thin Modular Smartphone Concept Design

Tecno Unveils Ultra-Thin Modular Smartphone Concept Design

by Tekmono Editorial Team
26/02/2026
in News
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Tecno has unveiled a groundbreaking modular smartphone concept design at MWC 2026, featuring a remarkably thin base unit measuring just 4.9mm thick, thinner than a standard pencil and Apple’s iPhone Air.

The base model’s slim design is complemented by a range of interchangeable modules, including a power bank module that increases the device’s thickness to that of a standard modern smartphone when attached. Tecno has developed a new interconnection technology for the system, utilizing a combination of magnets and pin connectors to facilitate module attachment and power delivery.

Magnets handle the physical attachment of modules, while pin connectors manage power delivery, and data transmission between the phone and various modules is handled wirelessly. The system is capable of switching between Wi-Fi, Bluetooth, and mmWave depending on the user’s location, ensuring seamless connectivity.

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Tecno has created a total of 10 modules for the ecosystem, including various camera lenses and a dedicated gaming controller, offering users a range of customization options. The design is available in two colorways: a silver-aluminum edition and a grey version, providing a sleek and premium aesthetic.

Although this release remains a concept design and is not currently available for consumer purchase, Tecno has previously released innovative devices, including an affordable foldable phone, a model featuring a pop-out portrait lens, and a foldable phone with a circular exterior display.

The modular smartphone concept has a history of limited commercial success, with notable examples including Google’s Project Ara prototype, which dates back over a decade but never shipped, and LG’s semi-modular G5, launched in 2016, which sold poorly. Moto also released semi-modular smartphones that failed to gain market traction.

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