Samsung has reportedly developed a new cooling technology for its upcoming Exynos2600 chipset, showcasing impressive results on Geekbench and 3DMark benchmarks. The innovative Heat Pass Block (HPB) technology promises to enhance thermal management.
The HPB technology integrates a copper heat sink layer directly into the chipset stack, positioning it closer to the heat source than traditional heat spreaders. This design allows for more efficient heat dissipation from the CPU, GPU, and NPU components, as it is incorporated within the stack itself, unlike conventional heat spreaders that are added after the package-on-package structure is assembled.
The Exynos2600 will be manufactured using Samsung’s advanced 2nm Gate-All-Around (GAA) process technology and is expected to power the Galaxy S26 series. Industry analysts suggest that some or all Galaxy S26 Ultra models may utilize a Snapdragon chip instead, while the distribution of chipsets across other S26 models and markets remains to be determined.
Samsung is anticipated to complete quality testing of the Exynos2600 soon, with an official unveiling expected in the coming months. The Galaxy S26 series is scheduled for release in late January or early February, marking the debut of this new chipset with its innovative cooling solution.
