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Apple signs  billion deal with Broadcom for U.S.-made wireless chips

Apple signs $30 billion deal with Broadcom for U.S.-made wireless chips

by Tekmono Editorial Team
09/07/2026
in News
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Apple has signed a more than $30 billion multiyear deal with Broadcom to design and produce over 15 billion U.S.-made custom wireless connectivity chips for its products.

As part of the agreement, Apple will invest $1.5 billion to expand Broadcom’s manufacturing facility in Fort Collins, Colorado. This partnership builds on Apple’s existing relationship with Broadcom, which serves as the primary hardware supplier for its wireless components.

This deal is part of Apple’s commitment to invest $600 billion in the U.S. economy over the next four years. This pledge was made in response to pressure from the Trump administration, which had previously threatened new tariffs on Apple products unless the company relocated core iPhone manufacturing to the U.S.

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While Trump later reversed the tariff policy, iPhone assembly has remained overseas. Apple stated that the collaboration with Broadcom will create “hundreds of American jobs,” a relatively small figure compared to the overall $30 billion investment.

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