Apple’s iPhone 18 Pro is expected to feature two new in-house chips this fall, according to analyst Jeff Pu, continuing the company’s rapid expansion of its custom silicon portfolio.
The move builds on a trend that began in earnest last year with the introduction of Apple’s custom chips. The C1 modem debuted in iPhone 16 with unexpected advantages, including improved battery life and better performance in congested network environments.
The follow-up C1X, which launched with iPhone Air and the M5 iPad Pro, offered speeds up to twice as fast. This progression indicates Apple’s commitment to enhancing its custom silicon technology, providing significant upgrades with each new iteration.
Apple also introduced its N1 wireless chip last fall, combining Wi-Fi 7, Bluetooth 6, and Thread into a single package. The N1 delivered improvements to Personal Hotspot and AirDrop reliability along with notable battery gains, showcasing the benefits of integrating multiple technologies into a single chip.
The iPhone 18 Pro is expected to feature a next-generation N2 wireless chip and C2 modem. While specific details on the N2 chip’s improvements remain unclear, the pattern established by Apple’s C-class modems suggests meaningful upgrades are likely.
The C2 modem is expected to add mmWave 5G support, addressing one of the key limitations of Apple’s earlier in-house modem designs. This addition is anticipated to further enhance the iPhone’s connectivity capabilities.
Apple’s silicon team has demonstrated a consistent ability to build surprise benefits into its custom chips. Taking greater control of the iPhone’s technology stack has clearly opened new opportunities for features and optimizations that were not possible when relying on third-party components.
